Stratasys F370
Technical specifications and precision grade for Stratasys F370.
Equipment Specifications
| Hard Specs | Build Envelope: 355 x 254 x 355 mm (14 x 10 x 14 in.); Layer Thickness Options: 0.330, 0.254, 0.178, 0.127 mm; Material Bays: 4 (2 model, 2 support) with auto-switching; Heated Build Chamber: Yes, for dimensional stability with engineering-grade materials; Supported Materials: PLA, ASA, ABS-M30, FDM TPU 92A, PC-ABS, Diran 410MF07, ABS-ESD7; Support System: QSR Soluble Support. |
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| Precision Grade | Achievable accuracy is typically within +/- 0.200 mm or +/- 0.002 mm/mm, whichever is greater. Part-to-part repeatability is high due to the controlled thermal environment. |